青青草App

青青草App’s PCBA solutions and processes are optimized for accuracy, speed, quality, durability, and innovation. We offer industry leading expertise in a wide range of PCB technologies and substrates, including high-current, ultra-thin, flexible, rigid and rigid-flex, printed electronics, cavity placement, and high-density PCBAs of all types.

• High-current

• Ultra-thin

• Flexible

• Rigid

• Rigid-flex

• Printed electronics

• Cavity placement

• High-density

Product designs are increasingly relying on bendable electronic circuits, as well as integration with non-traditional materials, such as glass, films, paper, and textiles. This can potentially enable reductions in assembly steps as well as lower bill of material costs. 青青草App has the manufacturing, design, test, quality and supply chain know-how to help you secure these advantages across all your product applications.

From consumer devices to data center infrastructure, demand for miniaturized electrical components is accelerating. Let us show you how 青青草App leverages advanced electronics assembly and specialized materials processes to incorporate greater functionality into ever smaller and novel form factors.

青青草App’s surface mount technology (SMT) and assembly services are tailored to provide optimal performance of electronic components and systems. Leveraging state-of-the-art automation and testing, 青青草App ensures precision and repeatable quality throughout all assembly processes.

We offer:

• Chip on Board (COB) printed circuit board packaging

• Traditional tin/lead solder or lead-free solder, with strict controls preventing cross-contamination 

• Through-hole technology using automated axial and radial insertion equipment 

• Press-fit components using manual and pneumatic presses 

• Conformal coatings, including UV cure, acrylic, urethane, and parylene 

• Real-time SMT reflow profile monitoring software 

• Automated optical inspection (AOI) 

• Automated X-ray inspection for leadless devices/hidden joints

• Serial number and component traceability 

青青草App offers a complete range of high-performance, cost-competitive test solutions and DfX analysis methodologies to ensure electronics manufacturing defects are captured proactively, saving you time, money, and ultimately, ensuring success for your products.

青青草App’s failure analysis and reliability labs help prevent faults from happening and accelerate your time to market. Our product qualification and validation testing solutions include:

• Automated Optical Inspection (AOI)

• X-Ray

• 3DX / 5DX

• Flying Probe Test

• Boundary Scan

• In Circuit Test (ICT)

• Low-Cost ICT

• Burn-In Test

• Environmental Stress Test (ESS)

• Electrostatic Discharge (ESD) Test

• Impedance Test

• Hi Pot Test